Rigid / Rigid - HDI RF - Microwave

Multilayer SBU 3+N+3 Cu filled

Application: Video Wall-Infotainment
Technology: Multilayer SBU with 3+N+3 with Cu filled stacked vias burried filled & Capped vias
Material: FR4 High TG with filler Iteq IT180A
Finishing: Black solder mask and Enepig

Multilayer 14 layer mixed layup

Application: Military radar
Technology: Multilayer 14 layer mixed layup
Material: FR4 High TG Iteq IT180 + Rogers RO3035 (Taconic RF35A2)
Via sequence: L1-L2, L1-L4 L1-L12 L1-L14 and cavity L2-L14
Finishing: Enig + Bondable 3 um plated gold

Multilayer 10 layer SBU 3+N+3 Laser vias

Application: Renewable Energy
Technology: Multilayer 10 layer SBU with 3+N+3 with Laser vias
Material: Low DK & DF material Isola Fr408HR High
Finishing: Enig

Multilayer 8 layer mixed layup

Application: Telecom
Technology: Multilayer 8 layer mixed layup Via Filled and capped, back drilled hole
Material: FR4 High TG with filler + Rogers RO4350. Via Filled and capped, back drilled hole
Finishing: Enig

Multilayer 6 layer laser via and UBGA

Application: Medical
Technology: Multilayer 6 layer with laser via and UBGA pitch 0.4 mm via in pad resin filled
Material: FR4 High TG with filler Nelco N4000-29
Finishing: Blue solder mask and Enig